Printed Circuit board technology space is vast and dynamic. Being an intermediary between mechanical and electronics parts, PCB industry has to be agile and alert to match the pace of innovations in other industries, especially the electronics.
There are a number ways PCBs can be manufactured based on the design needs. A via is an interconnect hole that resides in a solderable pad, where the requirements are for a flat, planar surface that does not contribute negatively to the placement or orientation of the soldered component.
Via-in pad technique increases density, enables better routing, and lessens inductance for better performing PCB in less board space. Via-in pad enhances the heat dissipation rate of PCB and thus are more reliable when it comes to temperature sensitive components. Using Via in pad, the miniature form factor of PCB can be achieved easily.
A via is placed directly beneath component contact pad, especially BGA pad with finer pitch array or HDI packages. This technique comes handy when working with micro-BGA designs where space is a constraint. Via-in pad does increase the number of steps in PCB process, but is one of the best ways to reduce the number of layers and get efficient PCB for your project. The cost for this process is mostly related to the cost of procuring and performing the conductive fill material which is the core step in the via in pad technique
Vias are basically divided into three broad types: Through-hole vias, Blind Vias, and Buried Vias. Each one them has a different role in PCB manufacturing. The two types of Via fills:
As an experienced PCB manufacturer, we are aware of the intricate design needs of manufacturing a PCB using via in pad. We have been using via in pad technology to manufacture high speed, highly reliable Printed Circuit Boards for a wide range customers like medical equipment manufacturers, defense, aerospace, traffic management, and many more.
Contact us today for more information.