Via-in Pad: Transforming the PCB industry

Printed circuit boards – a key component in the modern world
September 16, 2020
Canadian Circuits adds MASS Via Fill Equipment to its line-up
September 16, 2020
Via-in Pad Printed Circuit Board

Printed Circuit board technology space is vast and dynamic. Being an intermediary between mechanical and electronics parts, PCB industry has to be agile and alert to match the pace of innovations in other industries, especially the electronics.

There are a number ways PCBs can be manufactured based on the design needs. A via is an interconnect hole that resides in a solderable pad, where the requirements are for a flat, planar surface that does not contribute negatively to the placement or orientation of the soldered component.

Via-in pad technique increases density, enables better routing, and lessens inductance for better performing PCB in less board space. Via-in pad enhances the heat dissipation rate of PCB and thus are more reliable when it comes to temperature sensitive components. Using Via in pad, the miniature form factor of PCB can be achieved easily.

A via is placed directly beneath component contact pad, especially BGA pad with finer pitch array or HDI packages. This technique comes handy when working with micro-BGA designs where space is a constraint. Via-in pad does increase the number of steps in PCB process, but is one of the best ways to reduce the number of layers and get efficient PCB for your project. The cost for this process is mostly related to the cost of procuring and performing the conductive fill material which is the core step in the via in pad technique

Benefits of Vias to customers:

  • Smaller PCB footprint
  • BGA capability
  • Flat surface for SMD components over via

Types of Via-in pad

Vias are basically divided into three broad types: Through-hole vias, Blind Vias, and Buried Vias. Each one them has a different role in PCB manufacturing. The two types of Via fills:

  • Conductive Epoxies: Silver CB100, AE3030
  • Non-Conductive Epoxies: PHP-900, PP2795

Production Steps:

  • Drill Via Hole
  • Deburring
  • PTH
  • Electrolytic Cu Panel plating  (min wrap 0.0002”)
  • Bake
  • Via Fill
  • Scavenge –remove excess epoxy
  • Cure
  • Planarize- Remove excess glue
  • Clean

As an experienced PCB manufacturer, we are aware of the intricate design needs of manufacturing a PCB using via in pad. We have been using via in pad technology to manufacture high speed, highly reliable Printed Circuit Boards for a wide range customers like medical equipment manufacturers, defense, aerospace, traffic management, and many more.

Contact us today for more information.

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