HDI PCB : Higher connection density than the conventional printed circuit boards
The demand for smaller and lighter PCB has fueled the rise of Higher Density Interconnect PCB technology. Factors driving the exponential growth of HDI Printed Circuit Board segment are the miniaturization of electronic devices and increased requirement for powerful and efficient devices.
HDI is a cost-effective technology. The major advantage of HDI is that it facilitates placing of surface mounted components. The layers increase but the surface area or size decreases and the resultant PCB is better in quality, efficiency, and reliability.
Our HDI Capabilities: Advance Machines and Materials for HDI
HDI boards have high density of lines which are thin, tighter, and therefore need advanced sequential lamination and laser drill imaging. We have Orbotech Paragon 8800Hi LDI Machine for high depth-of-focus and accuracy in registration and uniformity printing for HDI and Rigid-Flex PCBs. LDI has no artwork process during exposure. Consequently, the time and cost of artwork setup can be saved. Customer gets high precision of alignment and imaging and high-quality parallel depth of field.
CCI has the capability to manufacture high-end legend designs in high mix production of HDI and MLB PCBs. We offer differential and Heavy copper Plating upto 40 ounces – Variable thickness copper plating on the same board for industrial/heavy equipment and machinery application. We can manufacture superior quality HDI at high speed using Exceptional UCI (UV Curing Integrated) Technology™.
HDI PCBs are better suited for devices where device weight, device size are critical apart from the high efficiency and performance. These boards provide high transmission speed and stable power which is required for the modern electronic devices. HDI Printed Circuit Board reduce RF, electronic, electromagnetic interferences which in turn reduce signal loss and crossing delays.
High Density Interconnect PCBs are usually built using advanced PCB technology like Laser Direct Imaging (LDI), Sequential Lamination, and Via-In_Pad Technology. CCI Canadian Circuits is one of the leading manufacturers of the HDI circuit boards in North America. We have an advanced machine line-up to manufacture high density boards as per customer needs.
There are some major pieces to the HDI puzzle:
Assembly complexity, IC packaging, printed wire board densities are some of the basic points to look at when getting into HDI.
- Fine Line/ Space
- Buried and Blind via
- Embedded Components
Vias make HDI printed circuit boards possible
VIP (ViaInPad) is the technology by which via is placed directly beneath component contact pad, especially BGA pad with finer pitch array or HDI packages. It gives smaller PCB footprint, BGA capability and flat surface for SMD components.
In HDI, Via holes are used to connect traces between the layers, these are different from the conventional component holes or through holes. The vias in a HDI board can be as small as .006” in diameter.
Vias are filled either with Conductive Epoxies or Non-Conductive Epoxies. We fill vias with following:
- Conductive Epoxies: Silver CB100, AE3030
- Non-Conductive Epoxies: PHP-900, PP2795
Different types of Vias:
- Type 4 PCB: HDI Printed Circuit Board (12 layer: 3- 6-3, Blind and Buried Vias)
- Type 3 Standard Process PCB (12 layer)-Only Through holes
- Via can also have a big impact on the manufacturing process, since they directly affect the number of lamination cycles.
- Type I (1+N+1) : Via on both sides of the board, single lamination cycle
- Type II(1+N+1): Via on both sides of the board, with Buried via in the core - 2 lamination cycles
- Type III(2+N+2): Via on both side of the board with or without blind via board , 3 lamination cycles
Building Vias and microvias is an intricate process, it involves laser drilling, filling, plating, and etching. We have advanced machinery and a highly experienced team that work on Vias to ensure our customers get perfectly hidden vias as per their design.
Lamination Cycle: Number of cycles the inner layer needs to be pressed or laminated. If the lamination cycle is more than one, then it is call sequential lamination.