High Density Interconnect (HDI) Boards
CCI Canadian Circuits Inc. is a trusted manufacturer of High Density Interconnect (HDI) PCB’s. Our HDI capabilities include:
- Fine lines and spaces – 3 mil traces and 3 mil spacing
- Blind and buried vias – Decrease overall board size, increased density on board
- Via-in-pad technology – Via filling with conductive or non-conductive.
- Differential and Heavy copper Plating to 40 ounces – Variable thickness copper plating on the same board for industrial/heavy equipment and machinery application.
- Hybrid Boards – Mixed Rogers & FR4 for RF Designs
- Metal Core Boards