We have accomplished and mastered the technology for Via in Pad
We have updated our capabilities and added 20 plus high layer count
Canadian Circuits has successfully achieved the challenging task of plating 30 oz copper plus differential copper on selected traces. We are excited to add this accomplishment to our capabilities and offer extreme copper thickness to our customers
We have added an Automated Exposure Unit to our facility to further improve outer layer registration
We have achieved heavy copper for all multilayer PCB’s
We have successfully added controlled impedance to our capabilities
Controlled Goods Certification (CGP) acquired
We have improved our capabilities by adding 3 mil lines and 3 mil spacing
Accomplished research project for D-Wave
Implemented PCB controlled impedance system, including impedance calculation, test coupon design, TDR impedance measurement with Zmetrix ST300, and test report.
Canadian Circuits hosted an open house after renovating the production facility with distinguished speakers, plant tours and prizes.
Accomplished large NRC Research Project
Successfully manufactured Hybrid Multilayer Boards (Rogers and FR4)
Our entire production facility was renovated to further enhance the manufacturing processes and quality of service.
Accomplished Blind Buried Vias
Canadian Circuits had the honour and privilege of manufacturing PCB boards for the 2010 Winter Olympic Rings displayed near the Vancouver International Airport (YVR).
ITAR Certification acquired
1993 – 2008
Expanded to a larger facility
Exhibited in tradeshows all across Canada
ISO Certification acquired
UL Certification acquired
Updated capabilities to include Flash Electroplating Nickel and Gold
Incorporated Flying Probe Electrical Testing (Mania Loc 8)
Automatic Optical Inspection – CAMTECH
Introduced new surface finish, Electroless Nickel, Immersion Gold (ENIG)