Capabilities

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At Canadian Circuits, we are consistently enhancing our capabilities because we understand that our customers require a wide range of manufacturing services. As a leading innovator in the Printed Circuit Board Industry, we are motivated to push our boundaries and improve our capabilities. Our factory is capable of manufacturing all production and prototype volumes in standard lead times to suit any demand. With over 20 years of experience in manufacturing a variety of standard and complex PCB’s, we are your one stop shop for all PCB needs!

PC BOARD TECHNOLOGIES STANDARD PROTOTYPE ADVANCED
(HDI)
Up To 20 Layers Yes Yes Yes
Blind & Buried Vias Yes Yes Yes
Via In Pad Yes Yes Yes
Sequential Lamination Yes Yes Yes
Impedance Control Yes Yes Yes
Hybrids & Mixed Dielectrics Yes Yes Yes
Rigid, Flex & Rigid-Flex Yes Yes Yes
Metal Core Yes Yes Yes
Conductive Hole Fill Yes Yes Yes
Edge Plating & Constellation Yes Yes Yes
Variety of Panel Sizes Available Yes Yes Yes
DIMENSIONS
Maximum Panel Sizes 18” X 24”
(457mm X 609mm)
18” X 24”
(457mm X 609mm)
12’ X 18”
(305mm X 457mm)
Maximum Usable area 16” X 22”
(406mm X 559mm)
16” X 22”
(406mm X 559mm)
10.4” X 16”
(264mm X 406mm)
Minimum Board Thickness 0.030”  (0.762mm) 0.005”  (0.127mm) 0.005” (0.127mm)
Minimum Core Thickness 0.014” (0.356mm) 0.005” (0.127mm) 0.003” (0.076mm)
Thickness Tolerance ±10% ±8% ±7%
Dimensional Tolerance ±10 mil ±7 mil ±5 mil
COPPER PADS & TRACES
Min Trace Width & Spacing 0.007”/0.007” (0.178mm/0.178mm) 0.005”/0.005” (0.127mm/0.127mm) 0.003”/0.003” (0.076mm/0.076mm)
Minimum SMD Spacing 0.004” (0.102mm) 0.004” (0.102mm) 0.004” (0.102mm)
Minimum SMD Pitch 0.008” (0.203mm) 0.008” (0.203mm) 0.008” (0.203mm)
Min Annular Ring – Via 0.005” (0.127mm) 0.004” (0.102mm) 0.003” (0.076mm)
Min Annular Ring – Component 0.007” (0.178mm) 0.005” (0.127mm) 0.003” (0.076mm)
Max Finish Cu Weight – Outer 8 OZ 20 OZ 40 OZ
Max Finish Cu Weight – Inner/td> 1 OZ 4 OZ 6 OZ
Minimum Pad Size For Testing 0.010” (0.254mm) 0.008” (0.203mm) 0.006” (0.152mm)
DRILLS
Smallest Drill Diameter 0.012” (0.305mm) 0.008″ (0.203mm) 0.006″ (0.152mm)
Minimum Plated Hole Size 0.008″ (0.203mm) 0.006″ (0.152mm) 0.006″ (0.152mm)
Minimum Unplated Hole Size 0.008″ (0.203mm) 0.006″ (0.152mm) 0.006″ (0.152mm)
Tolerance of Plated Holes ±0.003″ (±0.076mm) ±0.002″ (±0.051mm) ±0.002″ (±0.051mm)
Tolerance of Unplated Holes ±0.002″ (±0.051mm) ±0.002″ (±0.051mm) ±0.001″ (±0.025mm)
Maximum PTH Aspect Ratio 5:1 8:1 10:1
Blind And Buried Vias
Max Blind Via Aspect Ratio 5:1 8:1 10:1
Min Blind Via Hole Size 0.008″ (0.203mm) 0.008″ (0.203mm) 0.008″ (0.203mm)
Min Buried Via Hole Size 0.008″ (0.203mm) 0.008″ (0.203mm) 0.008″ (0.203mm)
Via In Pad
Conductive Fill Yes Yes Yes
Non-Conductive Fill Yes Yes Yes
SURFACE FINISHES
HASL Yes Yes Yes
ENIG Yes Yes Yes
ENENIG Yes Yes Yes
Immersion Silver Yes Yes Yes
Immersion Tin Yes Yes Yes
Lead Free HASL Yes Yes Yes
SOLDER MASK AND LEGEND
Green, Red, Black, Yellow, Blue, White, Clear, Grey, Purple Yes Yes Yes
FABRICATION
V-Score Yes Yes Yes
V-Score Angles 30° 30° 30°
Bevel Angles 15°, 30° and
45°
15°, 30° and
45°
15°, 30° and 45°
QUALITY AND TESTING
Certifications
ISO 9001:2015  Yes  Yes  Yes
UL E103209  Yes  Yes  Yes
IPC 6012, Class 1, 2 And 3  1 and 2  1 and 2  1 and 2
Test And Measurement
ZMetrix TDR  Yes  Yes  Yes
Camtek AOI  Yes  Yes  Yes
CMI XRF  Yes  Yes  Yes
MicroCraft, ATG FPT  Yes  Yes  Yes
Electrical Test Ranges
Continuity 5-80 Volts 5-80 Volts 5-80 Volts
Isolation 10M Ohm 10M Ohm 10M Ohm
Voltages 100 Volts 100 Volts 100 Volts
Controlled Impedance  ±10%  ±8%  ±7%
AVAILABLE REPORTS
Microsection  Yes  Yes  Yes
Solderability  Yes  Yes  Yes
CTM via X-Ray Fluorescence  Yes  Yes  Yes
Time Domain Reflectrometry  Yes  Yes  Yes
COC & FIR  Yes  Yes  Yes
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